Items tagged with foveros

Intel Accelerated took place yesterday, during which CEO Pat Gelsinger laid out a roadmap for the process technologies that will form the basis of its future processors (and those of its customers). Unfortunately, one interesting tidbit of the presentation that we didn't get a chance to bring significant attention to... Read more...
The ‘Intel Accelerated' webcast kicked off today, hosted by newly-minted CEO Pat Gelsinger and Dr. Ann Kelleher, SVP and general manager of Technology Development. The dynamic duo disclosed a number of new and interesting details regarding the company’s IDM 2.0 strategy along with Intel’s process and packaging... Read more...
Windows 10 on Arm is starting to gain more traction, thanks to a bevy of new systems based on Qualcomm's Snapdragon 8cx high-performance mobile SoC, and its second-gen follow-on which was just announced. Those laptops have all been defined by two common traits: exceptional battery life with still a few lingering app... Read more...
Trying to keep your head above water when navigating Intel's many 'lake' product names is no easy task, especially as we brace for more of them to show up. Intel 10th generation Comet Lake-S (14nm) desktop CPUs are right around the corner, and so are 11th generation Tiger Lake (10nm) mobile processors. Those tend to... Read more...
There's been lot of talk about Intel's 14nm Comet Lake and 10nm Tiger Lake processor architectures in recent months, but there's another revolutionary chip architecture also waiting in the wings: Lakefield. Lakefield uses Intel's Foveros 3D stacking technology and is built on the 10nm process node. Tech sleuth... Read more...
We first heard rumblings about Intel's Ponte Vecchio last week, and now Intel has officially announced its first base GPU architecutre that is aimed squarely at the high performance computing (HPC) and artificial intelligence (AI) markets. As we had all previously suspected, Ponte Vecchio is based on Intel's 7nm Xe... Read more...
We are in the era of chiplet designs, and given the growing complexity of today's silicon solutions, that is unlikely to change anytime soon. Along those lines, one thing Intel says often gets overlooked is the chip packaging on modern designs. As such, Intel is showcasing a new three-dimensional chip packaging... Read more...
Intel is providing a sneak peek (in rendered form) of its upcoming Lakefield processor family, which is based off its new Foveros three-dimensional stacked packaging technology that it detailed during its Architecture Day in Los Altos last December. While fine grain details are still under lock and key, a short video... Read more...
After years of delays, Intel is ready to put the pedal to metal with its 10nm computing products. Although it's been on Intel's roadmap for quite some time, Intel's first-generation 10nm platform, codenamed Ice Lake, is currently still tracking for a holiday 2019 launch for thin and light notebooks and 2-in-1... Read more...
On this episode of HotHardware’s Two And Half Geeks, Marco and Dave chat about Intel's new Sunny Cove 10nm CPU architecture, Intel Foveros 3D stacked chip technology, the beautiful and thin, leather-clad HP Spectre Folio laptop, ASUS' ROG Phone, GeForce RTX Ray Tracing performance in Battlefield V, details of our... Read more...
Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to the technical disclosures divulged to an exclusive group of attendees, Intel also talked about a shift in the... Read more...