Items tagged with foveros

Windows 10 on Arm is starting to gain more traction, thanks to a bevy of new systems based on Qualcomm's Snpadragon 8cx high-performance mobile SoC, and its second-gen follow-on which was just announced. Those laptops have all been defined by two common traits: exceptional battery life with still a few lingering app compatibility issues. Some app developers have been reticent to get on board the Arm-64 express and Microsoft is yet to enable emulation for 64-bit x86 applications, which limits overall compatibility. However, when an app does have a native Arm binary performance is solid, and the system's battery life can literally last for days. Though it's taking time, the always-on always-connected... Read more...
Trying to keep your head above water when navigating Intel's many 'lake' product names is no easy task, especially as we brace for more of them to show up. Intel 10th generation Comet Lake-S (14nm) desktop CPUs are right around the corner, and so are 11th generation Tiger Lake (10nm) mobile processors. Those tend to dominate the headlines, but today's leaked benchmark news focuses on Lakefield. What exactly is Lakefield and where does it fit into the land of lakes? Lakefield is a mobile client platform leveraging Intel's Foveros 3D stacking technology. About the size of a fingernail, Lake is an entirely new class of chip with a package area measuring 12mm x 12mm x 1mm. It's also a hybrid CPU... Read more...
There's been lot of talk about Intel's 14nm Comet Lake and 10nm Tiger Lake processor architectures in recent months, but there's another revolutionary chip architecture also waiting in the wings: Lakefield. Lakefield uses Intel's Foveros 3D stacking technology and is built on the 10nm process node. Tech sleuth TUM_APISAK located a UserBenchmark score from a previously unseen Core i5-L16G7. The "L" designation seemingly references its Lakefield roots, and it is a strange chip indeed. According to UserBenchmark, Core i5-L16G7 has a total of 5 cores with HyperThreading disabled, which means that it can execute 5 threads.  In this case, the Core i5-L16G7 has a single high-powered Sunny... Read more...
We first heard rumblings about Intel's Ponte Vecchio last week, and now Intel has officially announced its first base GPU architecutre that is aimed squarely at the high performance computing (HPC) and artificial intelligence (AI) markets. As we had all previously suspected, Ponte Vecchio is based on Intel's 7nm Xe architecture that will underpin products across a wide range of computing sectors, from discrete cards for desktops and integrated notebook solutions, to the HPC market and data center. Intel says that this first discrete GPU instantiation of Ponte Vecchio will be positioned to tackle HPC modeling and simulation workloads along with AI training, with high double-precision Floating... Read more...
We are in the era of chiplet designs, and given the growing complexity of today's silicon solutions, that is unlikely to change anytime soon. Along those lines, one thing Intel says often gets overlooked is the chip packaging on modern designs. As such, Intel is showcasing a new three-dimensional chip packaging technique that essentially combines Embedded Multi-Die Interconnect (EMIB) and Foveros. The new packaging technique is called Co-EMIB. It enables the linkage of even more computing performance and capabilities, Intel says, in part by allowing for the interconnection of two or more Foveros elements with essentially the performance of a single chip. It also allows designers to connect analog,... Read more...
Intel is providing a sneak peek (in rendered form) of its upcoming Lakefield processor family, which is based off its new Foveros three-dimensional stacked packaging technology that it detailed during its Architecture Day in Los Altos last December. While fine grain details are still under lock and key, a short video clip gives us a broad overview of the composition of Lakefield. Lakefield represents a move away from traditional chip packaging. Instead of a single die placed into slice of silicon, Foveros is a hybrid CPU architecture that enables combining different pieces of IP into a single package. That includes bits and pieces that might have otherwise have been discrete. By going with this... Read more...
After years of delays, Intel is ready to put the pedal to metal with its 10nm computing products. Although it's been on Intel's roadmap for quite some time, Intel's first-generation 10nm platform, codenamed Ice Lake, is currently still tracking for a holiday 2019 launch for thin and light notebooks and 2-in-1 convertibles. Intel's 10nm Ice Lake The Ice Lake platform is highly integrated, but at its core is Intel's 10nm Sunny Cove processor microarchitecture. Also along for the ride is are all-new instructions dedicated to machine learning (DL Boost), native Thunderbolt 3 connectivity (no more need for a dedicated Intel or third-party controller), Intel's Gen 11 graphics (which... Read more...
On this episode of HotHardware’s Two And Half Geeks, Marco and Dave chat about Intel's new Sunny Cove 10nm CPU architecture, Intel Foveros 3D stacked chip technology, the beautiful and thin, leather-clad HP Spectre Folio laptop, ASUS' ROG Phone, GeForce RTX Ray Tracing performance in Battlefield V, details of our Lenovo Holiday Giveaway and more! Show Notes: 06:15 - Intel Foveros To Usher In Industry First 3D Stacked System On A Chip Designs 15:55 - Intel Unveils 10nm Sunny Cove CPU Architecture With Gen11 Graphics, Major Performance Lift 31:44 - HP Spectre Folio Review: A Luxurious Leather-Clad Beauty 42:04 - NVIDIA GeForce RTX Ray Tracing In Battlefield V Explored Pre And Post Patch 53:13... Read more...
Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to the technical disclosures divulged to an exclusive group of attendees, Intel also talked about a shift in the company’s design and engineering model based on six strategic pillars -- Process, Architecture, Memory, Interconnect, Security, and Software – which it hopes will allow it to better address the needs of the current computing landscape moving forward. In addition to the architecture and roadmap news, Intel also talked about a new, very interesting 3D packaging technology it is... Read more...