Intel's Core i5-L16G7 Lakefield 3D Foveros CPU Spotted In Benchmark Leak

intel lakefield 2
There's been lot of talk about Intel's 14nm Comet Lake and 10nm Tiger Lake processor architectures in recent months, but there's another revolutionary chip architecture also waiting in the wings: Lakefield. Lakefield uses Intel's Foveros 3D stacking technology and is built on the 10nm process node.

Tech sleuth TUM_APISAK located a UserBenchmark score from a previously unseen Core i5-L16G7. The "L" designation seemingly references its Lakefield roots, and it is a strange chip indeed. According to UserBenchmark, Core i5-L16G7 has a total of 5 cores with HyperThreading disabled, which means that it can execute 5 threads. 

In this case, the Core i5-L16G7 has a single high-powered Sunny Cove core that is joined by four lower-power Tremont cores. In a way, this somewhat similar to ARM's big.LITTLE arrangement that we see in modern Exynos and Snapdragon SoCs.

intel lakefield 2
(Click to Enlarge)

The chip is pegged as having a 1.4GHz base clock and a turbo frequency of 1.75GHz. If previous reports are accurate, Lakefield CPUs will also include Gen11 graphics (sorry for those of you expecting Gen12 Xe graphics).

The Core i5-L16G7 was found nestled within a device labeled Samsung 767XCL. If we had to take a guess, we'd imagine that this is the upcoming Galaxy Book S that Samsung announced back in late October. At the time, Samsung said that the device would use a Lakefield processor.

At the time, Samsung didn't give a specific launch date for the device, but it did say that it would be the first Lakefield-powered product on the market. However, following the new Galaxy Book S' debut, it will be followed by Microsoft’s intriguing Surface Neo using the same processing platform.

Show comments blog comments powered by Disqus