IDF 2009 - Paul Otellini's Continuum
We made our annual pilgrimage to Intel Developer Forum this year and upon arriving in sunny San Francisco, we were greeted with the usual IDF fanfare in a sleek, modernistic environment. Presentations and demonstrations of Intel's latest cutting-edge technologies awaited us in the lobby as we noshed a bit on the continental breakfast buffet, but the glitz of table top demos were not what we really were after.
As Intel's slogan says: Sponsors of Tomorrow - Here soliciting "big ideas"...
Intel's Sean Maloney introduced Intel President and CEO, Paul Otellini setting the backdrop for this year's Intel Developer Forum with the big idea behind the company's conference theme: The Continuum. Intel's Continuum is a concept and vision of the future of technology where all devices inter-operate together seamlessly, from desktops, to notebooks, netbooks, and hand-held devices all leveraging standard platform technologies and cross-platform compatibility in software.
During the opening keynote, Otellini took the opportunity to flex Intel's manufacturing muscles, holding up an Intel manufactured 22nm SRAM test wafer. 32nm is in mass production today but 22nm technology is being test piloted now and is expected to become a production vehicle for 2H 2011. Incidentally, the wafer is made up of 364Mb SRAM devices comprising some 2.9 billion transistors.