by
Marco Chiappetta - Wed, Jan 20, 2010
VIA Revolutionizes Compact Embedded Design with the World's First Mobile-ITX Module
Introducing the VIA EPIA-T700, the first 6cm x 6cm computer-on-module based on the Mobile-ITX form factor
Taipei, Taiwan, January 19, 2010 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA
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