IDF Day 1: Keynotes, Skulltrail, PCIe3.0, 32nm
We continue to bring you breaking coverage from IDF today with a look inside keynote talks from Gordon Moore and Pat Gelsinger.
Snip: “Pat next focused on Intel’s current and future I/O innovations. He talked about the Tulapi SOC (System on a Chip) accelerator and then spoke of USB 3.0. According to Pat, USB 3.0 will offer a 10X increase in performance over USB 2.0 and will use both copper and optical interconnects. He also held up a couple of prototype USB 3.0 cables to show the room what they looked like.”
