IDF Day 1: Keynotes, Skulltrail, PCIe3.0, 32nm

We continue to bring you breaking coverage from IDF today with a look inside keynote talks from Gordon Moore and Pat Gelsinger.


Snip:  “Pat next focused on Intel’s current and future I/O innovations.  He talked about the Tulapi SOC (System on a Chip) accelerator and then spoke of USB 3.0.  According to Pat, USB 3.0 will offer a 10X increase in performance over USB 2.0 and will use both copper and optical interconnects.  He also held up a couple of prototype USB 3.0 cables to show the room what they looked like.”

 

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Tags:  32nm, PC, rail, E3, PCIe, pci, IDF, Keynote, skulltrail, note, IE, notes, key, AI, id, K
Dave Altavilla

Dave Altavilla

With nearly two decades of experience as a semiconductor sales engineer, Dave Altavilla founded HotHardware.com over 25 years ago with perspective as an industry insider and a passion for the wonders of system-level development and performance that culminate into the next generation, cutting-edge devices of tomorrow. Cultivated with the sweat-equity of time spent in the engineering backrooms and offices of Chief Architects of Wall Street bellwethers like Motorola, Cisco and EMC, Dave's insight into the design and manufacturing of leading-edge technologies, brings a laser-sharp understanding of what it takes to deliver a best-of-class product to market. Dave handles final editorial responsibilities of HotHardware's content, along with the site's creative vision and business development efforts. In addition to feature product launch articles at HotHardware for major OEM releases, Dave is also a published author in various technology-based print publications and has been a featured guest on various webcasts and Tech radio shows. In his spare time Dave likes to spend time on the ocean and coaching youth Baseball.  - Contact: davea(at)hothardware(dot)com and follow him on Twitter if you like. He also has an About.me page here.