Corsair Introduces Revolutionary Dual-path Heat Xchange (DHX) Memory Technology
Launches New DHX XMS2 DOMINATOR Product Line In Worlds Fastest DDR2 PC2-8888 CAS-4 Module Pair
Fremont, CA (August 28, 2006) - Corsair Memory, the worldwide leader in design and manufacture of high performance memory, today unveiled the latest innovation in high performance module design, Dual-path Heat Xchange (DHX) technology. This performance and reliability enhancing technology will be available in the latest memory product line from Corsair also launched today, the DHX XMS2 DOMINATOR Series. The advances provided by DHX enable the world's first PC2-8888 C4 (1111MHz at CAS Latency 4) speed rating on a production pair of 1 GByte modules.
The DHX XMS2 DOMINATOR PC2-8888 C4 module will also feature a Corsair DOMINATOR Airflow fan that provides vastly increased air circulation through the module heat sink. To complement the launch of the PC2-8888 module Corsair will also offer a lower cost PC2-8500 C5 module for customers who want the added features of DHX without requiring the additional speed boost provided by the PC2-8888 C4 solution.
Dual-path Heat Xchange (DHX) is the world's most advanced memory module thermal dissipation technology. This Patent Pending heat sink technology substantially increases the memory module's thermal dissipation so that the heat generated by the RAM cells can be more efficiently removed from the module. RAMs that run at lower temperatures enjoy improved performance and extended reliability.
Since traditional heat spreaders are only attached to the back surface of the memory packages there is no direct thermal path for the heat coming from the surface of the RAMs to escape through. The new Dual-Path Heat Xchange (DHX) technology developed by Corsair engineers uses two paths for the heat to escape from a memory device.