Items tagged with packaging

A report in the Korea Economic Daily is indicating that Samsung will be ready to start rolling out 3D packaging for high-bandwidth memory (HBM) later this year. This is a key technology that will enable the company to deliver its anticipated HMB4 offering, which is aimed at the AI market, sometime in 2025. This new... Read more...
The first purported images showing NVIDIA GeForce RTX 4070 graphics card packaging have emerged, and they depict what appears to be the inside and outside of a Founders Edition reference model carton. NVIDIA’s RTX 4070 remains unannounced, despite whispers that it would make an appearance at CES 2023. However, the... Read more...
Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to the technical disclosures divulged to an exclusive group of attendees, Intel also talked about a shift in the... Read more...