TECHNO Concept Reimagines Android Phones With Swappable Modular Components

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TECNO has peered into the future and now believes that modular smartphones are the way to go. Previewed ahead of the Mobile World Congress (MWC) show next week, TECNO has revived a modular concept ecosystem where ones like Google’s Project Ara faltered. By combining an ultra-thin 4.9mm base handset with a suite of magnetic, hot-swappable modules, the company is attempting to prove that customizable hardware can be functional and fashionably slim. Like many TECNO concepts, however, the odds of this making production appear low.

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Nonetheless, one can definitely admire the vision here. Central to the concept is the Modular Magnetic Interconnection system, with the base phone being thinner than almost any smartphone currently on sale. Even when a 4.5mm power bank module is snapped onto the back, the combined thickness remains relatively easy to palm in one's hand.

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To manage the flow of data between the phone and its attachments, TECNO utilizes a mix of Wi-Fi, Bluetooth, and mmWave communication, which in theory allows the modules to function with near-zero latency. For example, when the specialized action camera and a telephoto lens modules are attached, the low latency allows imaging data capture and the viewfinder feed to operate without noticeable latency.

The rear of the main device is mapped into eight modular zones, guiding the placement of accessories to ensure they align perfectly with the magnetic array and pogo-pin connectors. So far, the modular suite consists of roughly ten modules tailored to various niches, including tools for off-grid communication and even what looks like a gaming D-pad.

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There are also two versions of the hardware with separate visual identities. The ATOM edition utilizes silver aluminum paired with sharp red accents for a clean, industrial look. On the other hand, the MODA edition offers a "geek-inspired" design that plays with transparency and bolder textures. Both versions feature a laminated anti-glare glass back, designed to resist fingerprints while providing tactile and matte grip surfaces.

While the concept of modularity has historically struggled with consumer adoption due to its inherent complexity and added bulk, TECNO’s (and Ara's) approach intends for the user to only bring the hardware and accessories they need for the day while allowing for easy upgrades further down the road.

There is currently no confirmed price tag or retail release date, although attendees of the MWC next week can get hands-on time with the ecosystem at the TECNO booth.
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Aaron Leong

Tech enthusiast, YouTuber, engineer, rock climber, family guy. 'Nuff said.