OCZ Intros New Additions to Reaper HPC Series

OCZ Introduces New Additions to the Reaper HPC Series, with High Density DDR3 Kits Featuring Incredible Speeds

Sunnyvale, CA—May 7, 2008—OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced two new Reaper HPC solutions for enthusiasts upgrading to next generation of cutting-edge platforms. The PC3-14400 and PC3-12800 Reaper HPC Series are now available in both 2GB and 4GB dual channel kits to meet the specific needs of customized gaming systems or workstations, offering perfect compatibility with the latest platforms and chipsets at the height of DDR3 performance. 

“At OCZ we know that there is more than just one type of high end user, and we continually expand our DDR3 offering to deliver tailored solutions for a wide range of unique applications,” said Alex Mei, CMO of the OCZ Technology Group. “Our latest Reaper DDR3 kits are an ideal solution for hardcore gamers and overclockers looking for a combination of higher performance and stability supported by superior heat pipe based cooling.” 

With the high frequencies of DDR3 comes added heat that can damage the module’s sensitive ICs. To ensure superior stability and performance over the entire life of the modules, the Reaper HPC Series makes use of an innovative cooling solution to more effectively dissipate heat produced by high-speed memory. The thermo-conductive copper heat pipe conduit is ideal for overclocking where every degree matters, making certain that your cutting-edge investment will maintain its integrity throughout the toughest gaming missions, overclocking, or intense program applications.
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