Items tagged with lithography
One of the greatest obstacles standing between chip manufacturers and the pursuit of smaller, faster, processors is the lack of a proper light source. Current chips are etched using a deep ultraviolet wavelength of 193nm, but at a 28nm semiconductor process geometry, we've reached the limits of what a 193nm wavelength is small enough to etch, even when using immersion lithography (in which the chip is immersed in water). Extreme ultraviolet lithography (EUV) has been pegged as the most likely replacement for current 193nm technology, but repeated problems with ramping EUV have left it stalled on the runway. Now, for the first time, foundry technology developer ASML, which made headlines last...
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Last month, Intel announced a deal in which it would invest $4.1B in the photolithography company ASML in exchange for a 15% ownership stake in the company. Now, TSMC has followed suit with its own announcement. The Taiwanese foundry hinted in its last conference call that it might take this step, so it's not a surprise to see it following through. Under the terms of the deal, TSMC is investing €276 into developing extreme ultraviolet (EUV) lithography and 450mm wafer deployments, with a further €838 investment that buys it a 5% equity stake in the company. ASML is a vital company to both Intel and TSMC; it manufacturers the hardware that the two competitors use to build their respective...
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ARM AND GLOBALFOUNDRIES ESTABLISH A STRATEGIC PARTNERSHIP TO ENABLE APPLICATION OPTIMIZED SOC PRODUCTS ON 28NM HIGHK METAL GATE (HKMG) PROCESSRelationship leverages synergies between ARM’s leading low power processor architecture, optimized physical IP and partner Eco-system with GLOBALFOUNDRIES advanced technology, design and manufacturing excellence. CAMBRIDGE, UK – October 6, 2009 – ARM [(LSE: ARM); (Nasdaq: ARMH)] and GLOBALFOUNDRIES today announces a long-term strategic relationship to provide their mutual customers with an innovative SoC enablement program. To support the long-term relationship, GLOBALFOUNDRIES and ARM have signed a broad agreement on processor implementation...
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Global Foundries Calls for Renewed Focus on 300mm Manufacturing Innovation- At SEMICON West, the new leading-edge semiconductor foundry describes the need for increasing efficiency and minimizing waste in the 300mm manufacturing process - SAN FRANCISCO, CA – July 14, 2009 – In its effort to meet the ever-increasing demands of consumer technology, the semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers. While these are important tactics, opportunities for increasing efficiency, becoming more agile, and minimizing waste are often overlooked in manufacturing processes, according to Thomas Sonderman, vice president of manufacturing systems and technology...
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Global Foundries Appoints Head of Enterprise Quality, Completes Senior Leadership Team- Foundry industry expert to drive maximum quality and process improvement for customers as company positions for long-term success as an independent leading-edge foundry - SUNNYVALE, CA – July 7, 2009 – GLOBALFOUNDRIES today announced the appointment of Ron Dickinson as vice president of enterprise quality. The appointment marks the completion of the senior management team, cementing a strong leadership base to support the long-term growth and success of GLOBALFOUNDRIES as it aims to reshape the foundry landscape. In his role, Dickinson will enhance the customer experience by driving maximum levels of quality...
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GLOBAL FOUNDRIES Details Advanced Technology Aimed at 22nm and Beyond- At VLSI 2009, engineers describe new technique to continue scaling in HKMG transistors - SUNNYVALE, CA and KYOTO, JAPAN – June 16, 2009 – GLOBALFOUNDRIES today described an innovative technology that could overcome one of the key hurdles to advancing high-k metal gate (HKMG) transistors, bringing the industry one step closer to the next generation of mobile devices with more computing power and vastly improved battery life. The semiconductor industry is celebrated for overcoming seemingly insurmountable odds to continue the trend toward smaller, faster, and more energy-efficient products. Performed in partnership with IBM...
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