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Today, at ARM TechCon, AMD is kicking off the conference by launching its new embedded ARM platform (codenamed Hierofalcon) and its associated ARM Cortex-A57 chip, codenamed Seattle. This new solution is debuting inside the first ARM-based network function virtualization platform, and is meant as a proof-of-concept...
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Samsung Electronics has announced the creation of a new 32GB RDIMM with 3D TSV technology. The RDIMM (registered dual inline memory module) was made by stacking DDR3 SDRAMs that were manufactured by using 30nm-class process technology, and those SDRAMs were connected using the TSV (through silicon via) technology. This new module can provide...
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Corsair launched its new Dominator GTX ultra-high performance DDR3 memory modules for Intel and AMD platforms. The new memory modules target performance enthusiasts, gamers, and extreme overclockers. Each of the Dominator GTX modules are individually screened and tested to ensure they operate at the expected frequency of 2250MHz at low-latency...
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G.SKILL released its series of very high capacity DDR3 memory Taipei, Taipei, Taiwan--27th November, 2009--G.Skill International Co. Ltd., manufacturer of extreme performance memory and solid-state storage with solid quality, has today released its series of very high capacity DDR3 memory: 8GB (2GBx4) and 12GB (2GBx6) memory kits. G.Skill...
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If youre looking for some new memory for your computer and love the idea of being green, you might want to check out Super Talents latest DDR3 offering. The companys latest RAM uses 38% less PCB material and 47% less packaging material than Super Talents standard DDR3 DIMMs. Check out full details in the press release below. Super Talent...
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