Items tagged with 232-layer
Micron has announced that it is sending samples of its latest Universal Flash Storage (UFS) 4.0 ICs to smart device makers. Devices using these new NAND chips will benefit from double speed transfers compared to the previous gen UFS 3.1 solutions. The headlining figure given by Micron is that transfers of up to...
Read more...
Micron announced that it is shipping the world’s first client SSD using NAND flash with over 200 layers. The Micron 2550 NVMe SSD uses 232-layer TLC NAND, which the company says benefits consumers through density and power advantages.
The Micron 2550 SSD is rated for sequential reads and writes of up to 5.0 GB/s...
Read more...
Micron delivered some pretty big news today, saying it has begun volume production of the industry's first 232-layer triple-level cell (TLC) NAND flash memory chips with huge gains in area density, capacity, energy efficiency, and performance. In short, it's an improvement over 176-layer NAND in practically every...
Read more...
Micron is developing 232-layer NAND flash memory and expects to ramp up production by the end of the calendar year. Announced this week at its Micron Investor Day 2022 event, Micron is pitching its 232-layer technology as the "world's most advanced" NAND flash memory solution to power what it says will be industry...
Read more...
