VIA Moves into COM Express Embedded Market

by Marco Chiappetta — Monday, April 14, 2008, 01:00 PM EDT

VIA Moves into COM Express Embedded Module Market

VIA to introduce first COM Express modules with VIA processor platform, enabling cost effective, flexible customization and faster time to market

Taipei, Taiwan, April 14th 2008 - VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the extension of embedded board portfolio to include COM Express modules that will be the first to harness the power and thermal advantages of VIA's processor platforms.

Measuring 95mm x 125 mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to provide greater connectivity and data transfer bandwidth than the original COM (Computer-on-Module) standard. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, graphics, and Ethernet, through board-to-board connectors to an I/O baseboard.

Leveraging VIA's signature low heat, power-efficient platform silicon, the new fanless VIA COM Express modules will be powered by VIA Eden or VIA C7 processors ranging from 500MHz right up to 2GHz. Support for a comprehensive feature set of I/O implementations through VIA's versatile digital media IGP chipsets, while the option of onboard system memory provides vibration resistance for in-vehicle or heavy plant environments.

IA COM Express modules are targeted at industrial PC and large OEM customers focused on dynamic application segments, including gaming, healthcare and industrial automation. Customers can take advantage of a proprietary multi-I/O baseboard for evaluation purposes, or can utilize VIA's extensive technical support in developing a custom baseboard.

"With over six years of experience in small form factor board design and development, our entry into the embedded module market is a natural evolution for us," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "Flexible and modular solutions are an essential expansion of VIA's embedded platform range, strengthening our commitment to all sectors of the embedded industry."

Tags: VIA, Market, Pre, Embedded, XP, move, express, AR, COM, K

Marco Chiappetta

Marco's interest in computing and technology dates all the way back to his early childhood. Even before being exposed to the Commodore P.E.T. and later the Commodore 64 in the early ‘80s, he was interested in electricity and electronics, and he still has the modded AFX cars and shop-worn soldering irons to prove it. Once he got his hands on his own Commodore 64, however, computing became Marco's passion. Throughout his academic and professional lives, Marco has worked with virtually every major platform from the TRS-80 and Amiga, to today's high end, multi-core servers. Over the years, he has worked in many fields related to technology and computing, including system design, assembly and sales, professional quality assurance testing, and technical writing. In addition to being the Managing Editor here at HotHardware for close to 15 years, Marco is also a freelance writer whose work has been published in a number of PC and technology related print publications and he is a regular fixture on HotHardware’s own Two and a Half Geeks webcast. - Contact: marco(at)hothardware(dot)com