GlobalFoundries is the manufacturing arm for AMD processors (among other companies), and this week they're announcing plans to "expand its global semiconductor manufacturing operations with a series of new projects across its 300mm operations designed to support expected increases in both near-term and long-term customer demand." An additional wafer manufacturing plant will be built in Dresden, and the company will expand the cleanroom shell at a fabrication plant in New York. No matter how you slice it, it's great to hear of a fabricator expanding during uncertain times. Chia Song Hwee, chief operating officer, had this to say:
"Our 300mm fabs have been consistently ranked among the most advanced and efficient in the industry. Now we are taking our heritage of lean foundry manufacturing and world-class fab performance and making it available on a broader scale to meet the demands of the world’s leading chip design companies. With this aggressive capacity build-out plan, we are well positioned to provide new and existing customers with the fastest option to get advanced products to market in the volumes they need to ensure success."
Additional details can be found below; it's hard to say what exactly the impact of these builds will have on future AMD chips, but having the ability to produce more on a whim certainly bodes well for anyone working in collaboration with GlobalFoundries. C'mon AMD, give these guys a reason to push their new maximums to the limit.
By making additional investments in leading-edge capacity, GLOBALFOUNDRIES continues to take an aggressive long-term approach to driving sustained growth and technology leadership on advanced technologies. These new expansion projects are also expected to create hundreds of new jobs at the Fab 1 and Fab 8 campuses.
“Our 300mm fabs have been consistently ranked among the most advanced and efficient in the industry,” said Chia Song Hwee, chief operating officer, GLOBALFOUNDRIES. “Now we are taking our heritage of lean foundry manufacturing and world-class fab performance and making it available on a broader scale to meet the demands of the world’s leading chip design companies. With this aggressive capacity build-out plan, we are well positioned to provide new and existing customers with the fastest option to get advanced products to market in the volumes they need to ensure success.”
At the company’s leading-edge Dresden manufacturing campus, Fab 1, the expansion focus will be on adding new capacity to support additional growth opportunities for 45/40/28nm technologies as well as initial 22nm development. This expansion will see a new facility constructed at Fab 1 that will add nearly 110,000 square feet of cleanroom space to enable the site to scale output up to 80,000 wafers per month over the next two years. The largest wafer fab in Europe, Fab 1’s leading-edge wafer fabrication equipment will cover an area equivalent to approximately eight soccer fields. The first output from this new expansion is expected in 2011 with construction work planned to start immediately. The start of this expansion project at Fab 1 is, however, still subject to the approval of a state aid package by the German authorities and the European Commission.
To support long-term growth at the 22/20nm generation, GLOBALFOUNDRIES plans to expand Fab 8, the company’s new leading-edge fab currently under construction at the Luther Forest Technology Campus in Saratoga County, New York. The expansion will increase the size of the cleanroom shell by approximately 90,000 square feet, bringing the total available cleanroom space to approximately 300,000 square feet, equivalent to roughly six soccer fields of state-of-the-art wafer fabrication equipment. The total facility, including cleanroom support infrastructure and office space, includes more than 1.3 million square feet of space and is expected to come online in 2012 with volume production targeted for early 2013. The larger cleanroom would allow for the future fit-up and equipment necessary to enable a total output of approximately 60,000 wafers per month once fully ramped.
In addition to the capacity expansion projects at Fab 1 and Fab 8, GLOBALFOUNDRIES majority shareholder, the Advanced Technology Investment Company (ATIC), announced initial plans for the creation of an advanced technology cluster in Abu Dhabi. The site, adjacent to Abu Dhabi International Airport and measuring three square kilometers in size, is ideally suited to house a future advanced technology cluster in the region with close proximity to regional transportation hubs and physical infrastructure. GLOBALFOUNDRIES is committed to partnering with ATIC to share best practices and expertise in cluster creation in the near-term and putting a significant technology and manufacturing presence in the region long term. The goal for the site is to be the Middle Eastern hub of a global technology and manufacturing network to support the long-term deployment of capital for ATIC portfolio companies, in capital-intensive advanced technologies.
“The formation of the new GLOBALFOUNDRIES was predicated on creating a world-class technology and manufacturing company that had the scale and resources to compete for industry leadership in this capital intensive market,” said Ibrahim Ajami, chief executive officer, ATIC. “For ATIC, this also represented the first step in Abu Dhabi’s vision to become a leader in the semiconductor industry. Today we announce the next phase as we take our first steps in establishing a world-class advanced technology cluster over the coming years. We look forward to working with the GLOBALFOUNDRIES team to leverage the collective successes of Singapore, Dresden and New York as we create the industry’s next innovation cluster in Abu Dhabi.”
In addition to new expansion initiatives in Dresden and New York, GLOBALFOUNDRIES also is continuing with its previously announced expansion at Fab 7 in Singapore to reach an output level of 50,000 wafers per month, an increase of nearly 50 percent from current levels. During the expansion, Fab 7 will continue to focus on manufacturing technologies ranging from the 65nm to 40nm technology nodes.