Xiaomi Taps TSMC For 3nm Xring O3 Chip With LPDDR6 To Battle Qualcomm

by Aaron Leong — Monday, August 24, 2026, 10:27 AM EDT

Xiaomi's promo picture of the XRing O3 SoC - Image: Xiaomi

Xiaomi has expanded its silicon independence by unveiling the XRing O3, a custom flagship mobile processor built on TSMC’s 3-nanometer process node with support for LPDDR6 memory. Early performance signs via AnTuTu are proving to be very promising as well.

Xiaomi’s Xring O3 has achieved an AnTuTu score of 5.22 million, far surpassing every smartphone processor currently available. Its GPU performance has improved by a massive 85%. The chip features six ultra-large CPU cores plus four additional cores, and is also the first to… pic.twitter.com/ox8mOFpZLX
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Manufactured on TSMC's N3P node with 24 billion transistors spread over a 133mm² die, the XRing O3 represents Xiaomi's most aggressive push away from standard third-party mobile silicon. Ditching efficiency cores entirely, the chipset adopts a 10-core all-big CPU cluster. This setup features two C1-Ultra cores running up to 4.35GHz, four C1-Premium cores clocked at 3.68GHz, and four C1-Pro cores reaching 3.15GHz.

Early benchmark testing places performance in the ultra-flagship territory, boasting a 3,945 Geekbench 6.5 single-core score and a multi-core score of 15,221, which supposedly rivals the raw multi-core throughput of Apple's M4 desktop chipset.

XRing O3 CPU scores - Image: Xiaomi/machine translation

Further still, the XRing O3 presentation also showed off AnTuTu test runs whereby the XRing O3 broke past the 5-million barrier—5,228,014, to be exact. A significant portion of this score is driven by the chip's 16-core Mali-G2 Ultra NX GPU, which incorporates dedicated on-die neural cores to execute frame generation and spatial upscaling directly within the GPU cache hierarchy without clogging the NPU or system memory. Also, the SoC becomes the first to support LPDDR6 memory at speeds up to 10,667MT/s, pushing peak memory bandwidth to 113.8GB/s to feed both the GPU and its 200 TOPS NPU.

XRing O3 GPU scores - Image: Xiaomi/machine translation

Xiaomi's not just limiting its sights on mobile devices. The company has a deal with TSMC that extends beyond the O3: to wit, Xiaomi revealed the XRing O100, a 6nm NPU with near-memory architecture built for multi-device AI tasks, and the XRing D100, a 3nm custom automotive chip designed to power autonomous driving systems in Xiaomi's electric vehicle line.

The XRing O3 is slated to make its commercial debut in the upcoming Xiaomi 18 Fold and the Pad 9 Pro Max, with initial production shipments targeting 200,000 to 300,000 units. While independent lab verification will actually see how the all-big-core architecture handles sustained thermal throttling, initial hardware specs and benchmark numbers does put Xiaomi as a formidable self-silicon contender.