OCZ's latest solution for cooling their high performance memory modules is the Reaper Heat Pipe Conduit (HPC) system. The Reaper HPC memory uses a combination of an aluminum heatspreader, copper heatpipe, and aluminum fin array to quickly dissipate heat. Heat generated by the memory is absorbed by the heatspreader, where it is then transported to an aluminum fin array which then dissipates the heat into the surrounding air. In theory this method should cool the memory modules much more efficiently than the flat heatspreaders most other memory modules sport.
In this article, we evaluate the original PC2-8500 Reaper HPC kit and the newer Enhanced Bandwidth Edition PC2-6400. Click the link below and check them out...