OCZ Reaper Heat Pipe Conduit DDR2

by Marco Chiappetta — Monday, June 18, 2007, 11:30 AM EDT

OCZ's latest solution for cooling their high performance memory modules is the Reaper Heat Pipe Conduit (HPC) system. The Reaper HPC memory uses a combination of an aluminum heatspreader, copper heatpipe, and aluminum fin array to quickly dissipate heat. Heat generated by the memory is absorbed by the heatspreader, where it is then transported to an aluminum fin array which then dissipates the heat into the surrounding air. In theory this method should cool the memory modules much more efficiently than the flat heatspreaders most other memory modules sport.

In this article, we evaluate the original PC2-8500 Reaper HPC kit and the newer Enhanced Bandwidth Edition PC2-6400. Click the link below and check them out...

OCZ Reaper Heat Pipe Conduit DDR2

Tags: DDR, DDR2, OCZ, ui, heat, DUI, Pi, EA, IP, AP

Marco Chiappetta

Marco's interest in computing and technology dates all the way back to his early childhood. Even before being exposed to the Commodore P.E.T. and later the Commodore 64 in the early ‘80s, he was interested in electricity and electronics, and he still has the modded AFX cars and shop-worn soldering irons to prove it. Once he got his hands on his own Commodore 64, however, computing became Marco's passion. Throughout his academic and professional lives, Marco has worked with virtually every major platform from the TRS-80 and Amiga, to today's high end, multi-core servers. Over the years, he has worked in many fields related to technology and computing, including system design, assembly and sales, professional quality assurance testing, and technical writing. In addition to being the Managing Editor here at HotHardware for close to 15 years, Marco is also a freelance writer whose work has been published in a number of PC and technology related print publications and he is a regular fixture on HotHardware’s own Two and a Half Geeks webcast. - Contact: marco(at)hothardware(dot)com