LG Unfazed By Snapdragon 810 Overheating Reports, Performance 'Quite Satisfactory'

LG Electronics today said that it didn't run into any overheating issues with Qualcomm's newest Snapdragon System-on-Chip (SoC) and will hold firm to plans to use the company's chip in its forthcoming G Flex 2 handset that's due to launch in South Korea at the end of this month (January 30) and in the U.S. sometime after.

The issue of Qualcomm's Snapdragon 810 processor possibly having an overheating issue was raised when Samsung earlier this week said it had encountered some problems with the part during the testing phase of its Galaxy S6 smartphone. Samsung ultimately decided not to use the chip, and presumably will run with its own Exynos hardware, which is already found in some Galaxy S5 handsets.

LG G Flex 2

"I am very much aware of the various concerns in the market about the [Snapdragon] 810, but the chip's performance is quite satisfactory," Woo Ram-chan, LG vice president of mobile product plannings, stated during a press event. "I don't understand why there is an issue over heat."

Contrary to Samsung's findings, Ram-chan said that LG's own internal testing for the G Flex 2 showed that the smartphone actually produces less heat than the company's other smartphones on the market.

The G Flex 2 is a curved phone with a 5.5-inch Full HD 1080p (1920x1080) display. In addition to the Snapdragon 810 processor, it will also feature 2GB of RAM, 16GB or 32GB of internal storage, microSD card slot, 802.11ac Wi-Fi, Bluetooth 4.1, 2MP front-facing camera, 13MP rear-facing camera with optical image stabilization, 3,000 mAh battery, and Android 5.0 Lollipop.