AMD Introduces ASB2 And AM3 Platforms For Embedded Systems

AMD already catered to the professionals this morning with new FirePro graphics cards, and now the embedded market is getting some attention as well. At Embedded Systems Conference today, AMD announced a pair of completely revamped platforms for this highly important, but oft overlooked, market sector. The two new ones are the compact ASB2 platform and the high-performance AM3 platform, both of which promise various combos of power and performance with up to 74% improvement in performance-per-watt over previous generations.

AMD’s new embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP, with the main goal here being to get more x86 systems into the wild. Buddy Broeker, director, Embedded Solutions Division, stated the following: "The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon. AMD’s embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion technology products into the embedded space."

Have a look at the key points from today's announcement below, and get ready for AMD to power your next carputer, or auto-pilot car. Who knows, it could happen!

Embedded industry leaders support the benefits of AMD’s approach to x86 and complete platform solutions in the market. Read what customers iBASE and Quixant have to say about AMD Embedded Solutions.

New Platform Features

  • Faster memory with support for 2 channels DDR3
  • Improved I/O for high-throughput and real-time applications with available HyperTransport™ 3.0 technology
  • ECC for high-reliability applications like SMB/SOHO storage systems
  • Multiple CPU options that offer wide choice of performance and power
    • Power envelopes in 8, 12, 15, 25, 45, and 65 watts TDP
    • Single-, dual- and quad-core
    • Up to 2.8 GHz
  • AMD 785E chipset with support for PCI Express® 2.0
  • New ATI Radeon™ HD 4200 graphics with DirectX® 10.1, full 1080p display resolution support, HDMI, and power-savings capability with options to support multiple displays
  • Socket AM3 package, compatible with socket AM2 when using DDR2 memory for increased design flexibility and scalability
  • Lidless BGA package offers low-cost to manufacture, high reliability, and low z-height for small form factors and fan-less designs

Tags:  AMD, GPU, CPU, Chipset, Embedded