AMD Delivers the Ultimate Mobile Platform with New 65nm AMD Turion 64 X2 Dual-Core Mobile Technology
NVIDIA and Broadcom join AMD to showcase platform performance advantages in 3D graphics, Wireless Range and Throughput, and Battery Life
SUNNYVALE, Calif. - May 2, 2007 - NVIDIA and Broadcom joined AMD (NYSE: AMD) to showcase the 3D graphics, wireless, battery life, and compute performance advantages of next-generation AMD mobile platforms at an event held in San Francisco today. Based on superior technologies from the AMD Better by Design program -- including next-generation 65nm AMD Turion 64 X2 dual-core mobile technology, chipsets from AMD and NVIDIA, and leading wireless networking solutions from Broadcom -- these mobile platforms deliver a superior Windows(tm) Vista experience for end-users.
AMD's award-winning 65nm Silicon-on-Insulator technology provides increased transistor performance, scalability and power efficiency. AMD Turion 64 X2 dual-core mobile technology based on the 65nm process, now shipping, represents an important milestone as AMD continues its rapid conversion of Fab36. Notebook PCs based on the new AMD Turion 64 X2 dual-core mobile technology will be available later this quarter in designs from leading computer manufacturers.
AMD Mobile Platforms: Better by Design
AMD's leading-edge Better by Design ecosystem includes ATI Radeon and NVIDIA GeForce Go graphics and wireless solutions from Atheros, Broadcom, Marvell Qualcomm and RealTek.
"Our next generation mobile processors, combined with superior graphics and wireless technologies demonstrate our commitment to an open platform strategy, which enables our OEM customers to design the ultimate mobile platforms," said Chris Cloran, vice president, AMD Mobile Division. "PC users today expect more from their computers and the Better by Design program features the superior technologies and leading-edge performance buyers seek to meet the demands of their ever-expanding digital lifestyle." READ MORE.