Items tagged with ufs 3.1

When it comes to smartphones, the primary system-on-chip (SoC) and camera arrangement tend to dominate the discussion, as does the overall build quality and whatever unique features a particularl handset might bring to the table. Storage deserves some attention too, though. To that end, Micron today announced it has begun volume shipments of the industry's first 176-layer NAND Universal Flash Storage 3.1 for mobile devices. It has been eight months since Micron pounded its chest at delivering first 176-layer 3D NAND solution, "achieving unprecedented, industry-pioneering density and performance." Today's announcement sees the same core technology ported over to the mobile space, where it will... Read more...