Items tagged with chip stacking

Big Blue and innovator 3M are joining together to develop an adhesive that will take 3D chip stacking to new heights, both literally and figuratively. For well over a decade, IBM has been researching and developing chip stacking, which is the next generation of microprocessor technology that follows Moore’s Law. Faced with ever-shrinking dies, researchers had a problem, and they had nowhere to go but up. They realized that instead of trying to cram more into a single wafer of silicone, they could stack the sheets on top of on another to fit many times more chip components into the same die footprint. What you end up with is, as IBM describes it, a brick of silicone or (my preferred description)... Read more...