Items tagged with 300mm
Last month, Intel announced a deal in which it would invest $4.1B in the photolithography company ASML in exchange for a 15% ownership stake in the company. Now, TSMC has followed suit with its own announcement. The Taiwanese foundry hinted in its last conference call that it might take this step, so it's not a surprise to see it following through. Under the terms of the deal, TSMC is investing €276 into developing extreme ultraviolet (EUV) lithography and 450mm wafer deployments, with a further €838 investment that buys it a 5% equity stake in the company. ASML is a vital company to both Intel and TSMC; it manufacturers the hardware that the two competitors use to build their respective...
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ARM AND GLOBALFOUNDRIES ESTABLISH A STRATEGIC PARTNERSHIP TO ENABLE APPLICATION OPTIMIZED SOC PRODUCTS ON 28NM HIGHK METAL GATE (HKMG) PROCESSRelationship leverages synergies between ARM’s leading low power processor architecture, optimized physical IP and partner Eco-system with GLOBALFOUNDRIES advanced technology, design and manufacturing excellence. CAMBRIDGE, UK – October 6, 2009 – ARM [(LSE: ARM); (Nasdaq: ARMH)] and GLOBALFOUNDRIES today announces a long-term strategic relationship to provide their mutual customers with an innovative SoC enablement program. To support the long-term relationship, GLOBALFOUNDRIES and ARM have signed a broad agreement on processor implementation...
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Global Foundries Calls for Renewed Focus on 300mm Manufacturing Innovation- At SEMICON West, the new leading-edge semiconductor foundry describes the need for increasing efficiency and minimizing waste in the 300mm manufacturing process - SAN FRANCISCO, CA – July 14, 2009 – In its effort to meet the ever-increasing demands of consumer technology, the semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers. While these are important tactics, opportunities for increasing efficiency, becoming more agile, and minimizing waste are often overlooked in manufacturing processes, according to Thomas Sonderman, vice president of manufacturing systems and technology...
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Intel To Build 300mm Wafer Fabrication Facility In China Fab 68 in Dalian is $2.5 Billion Investment BEIJING, March 26, 2007 - Intel Corporation today announced plans to build a 300-millimeter (mm) wafer fabrication facility (fab) in the coastal Northeast China city of Dalian in Liaoning Province. The $2.5 billion investment for the factory designated Fab 68 will become Intel's first wafer fab in Asia and adds significant investment to Intel's existing operations in China. "China is our fastest-growing major market and we believe it's critical that we invest in markets that will provide for future growth to better serve our customers," said Intel President and CEO Paul Otellini....
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