AMD Radeon Fury And Fury X Specs LEAKED, HBM-Powered Killer Graphics On The Way
Earlier this week, XFX sprung a leak which revealed its Radeon R9 390X graphics card to all. But as we all sit around eagerly awaiting the arrival of Fiji-based Radeons, this card unfortunately didn’t fit the bill. The R9 390X is little more than an R9 290X “Hawaii” re-badge with 8GB of GDDR5 memory.
But for those of us that are still holding out hope for some fresh Fiji info, there’s an abundance of supposedly confirmed specifications for what will be AMD’s most powerful graphics card to date. Fiji will initially be available in both Pro and XT variants with the Fiji Pro dubbed “Fury” and Fiji XT being dubbed “Fury X.”
To get a taste for how potent these news chips are, take a look at the alleged spec table below...
|GCN Compute Units
|Render Output Units
|Texture Mapping Units
|Effective Memory Speed
|Liquid, 120mm Radiator
|Air, 3 Axial Fans
|Air, 3 Axial Fans
|Air, Single Blower Fan
|≥ 8.6 TFLOPS
As you can see, the standard Fury is slightly neutered compared to the Fury X, given its pared down stream processors, compute units, and texture mapping units. But when all is said and done, the garden variety Fury still touts single-precision floating point (SPFP) performance of 7.2 FLOPS compared to 5.6 TFLOPS for a bone stock Radeon R9 290X. That’s a roughly 29-percent performance improvement, which is nothing to scoff at in the graphics world. The Fury X with its 4096 stream processors, 64 compute units, and 256 texture mapping units manages to deliver 8.6 TFLOPS, or a 54-percent increase over a Radeon R9 290X.
But that’s not where the fantasy ends. Both the Fury and Fury X by default dissipate heat via three axial fans. That’s all well and good, but those who want the ultimate in graphics performance know that you need to slap a big ‘ol radiator on that GPU to get some water cooling action going. The range-topping, water-cooled Fury X shares the same physical hardware specs as the air cooled Fury X, but will see its GPU clock increased by an unspecified amount, which should allow it to deliver slightly more than 8.6 TFLOPS.
The star of the show, however, will be AMD’s High Bandwidth Memory (HBM) interface, which we detailed here on HotHardware last month. Unlike traditional GDDR5 memory, HBM is actually stacked vertically, decreasing the PCB footprint required. It’s also integrated directly into the same package as the GPU/SoC, leading to further efficiencies, reduced latency and a blistering 100GB/sec of bandwidth per stack (4 stacks per card). On average HBM is said to deliver three times the performance-per-watt of GDDR5 memory, which is definitely fine by us.
With that being said, the specs listed above are by no means confirmed by AMD — yet — but we shall find out soon enough during AMD’s E3 press conference scheduled for June 16 at 12 PM EST.
We’ll have all the official details for you when they become available, but needless to say, you likely won’t be disappointed.