T-RAM and GLOBALFOUNDRIES enter into Joint Development Agreement for application of T-RAM’s Thyristor-RAM embedded memory to advanced technology nodes
MILPITAS, Calif. - T-RAM Semiconductor Inc. (T-RAM) and GLOBALFOUNDRIES announced today that they have entered into a joint development agreement targeted toward the application of T-RAM’s Thyristor-RAM embedded memory to advanced technology nodes.
According to Gregg Bartlett, Senior Vice President of Technology and R&D at GLOBALFOUNDRIES, “We are pleased to be jointly developing T-RAM memory for 32nm and 22nm technologies. T-RAM’s embedded memory technology shows a great deal of potential for use in low-power, high-performance dense cache applications for advanced technology nodes.”
Sam Nakib, President and CEO of T-RAM, added, “We are excited about working with GLOBALFOUNDRIES on the next generation embedded memory technology. T-RAM has successfully completed extensive development of the Thyristor-RAM technology and has delivered a fully manufacturable and robust memory solution with proven yield, reliability, and low-cost of integration in earlier technology nodes. We believe that GLOBALFOUNDRIES and their customers’ products provide a great opportunity to further develop and show-case T-RAM’s significant performance and economic advantages. T-RAM’s revolutionary Thyristor-RAM memory technology provides the highest combination of density and performance among all embedded memory technology candidates, and avoids the fundamental scalability challenges that face 6T-SRAM and other FET-based memory cells.”
- The joint development agreement is targeted at implementing T-RAM’s embedded memory technology into our manufacturing processes at the 32nm node and below.
- The technology can be used in bulk and SOI processes, which are both being aggressively developed by GLOBALFOUNDRIES for advanced nodes.
- The increase in density offered by T-RAM’s embedded memory has the potential to enable much larger on-chip cache memories.
- Not only can this technology be used to enhance the performance and power-consumption of microprocessors, but it also shows promise for other applications, such as system-on-chip designs for netbooks, smartphones, and other mobile devices.
- The technology has been proven at earlier nodes, but this will be the first implementation in a leading-edge process.
- We have a history of bringing up leading-edge technologies in high volume with mature yields. Working with T-RAM to develop and implement this technology will help drive the learning curve and reduce the barriers of entry for our customers.
Marco Chiappetta
Marco's interest in computing and technology dates all the way back to his early childhood. Even before being exposed to the Commodore P.E.T. and later the Commodore 64 in the early ‘80s, he was interested in electricity and electronics, and he still has the modded AFX cars and shop-worn soldering irons to prove it. Once he got his hands on his own Commodore 64, however, computing became Marco's passion. Throughout his academic and professional lives, Marco has worked with virtually every major platform from the TRS-80 and Amiga, to today's high end, multi-core servers. Over the years, he has worked in many fields related to technology and computing, including system design, assembly and sales, professional quality assurance testing, and technical writing. In addition to being the Managing Editor here at HotHardware for close to 15 years, Marco is also a freelance writer whose work has been published in a number of PC and technology related print publications and he is a regular fixture on HotHardware’s own Two and a Half Geeks webcast. - Contact: marco(at)hothardware(dot)com
