LG is gearing up for a big MWC 2019 showing and is already teasing its flagship device that will be unveiled at the show. LG has in the past teased a device using a Snapdragon 855 SoC and packing a 5G modem for the show, but it's unclear if that device is the G8 ThinQ. LG has now announced that it has teamed up with Infineon and that the LG G8 ThinQ to be unveiled at the show will pack the new Infineon REAL3 Time-of-Flight (ToF) image sensor chip.
LG says that the new sensor is going to play a critical role in the front-facing camera of the G8 ThinQ smartphone. The sensor builds on the combined skills of Infineon and
Using reflected infrared light makes the ToF chip faster and more effective in ambient light conditions and reduces the workload on an application, reducing battery usage as a byproduct. Since ToF sensors perform better than alternatives, the tech is widely used in biometric authentication methods like face-recognition according to LG. The IR light that the sensor detects is unaffected by other light sources, allowing ToF sensors to deliver better recognition rates indoors and out, making them work well for AR and VR applications.
Infineon is aiming the
Stay tuned for our MWC 2019 coverage later this month, as there are bound to be loads of new smartphones (and accessories) announced packing the latest and greatest tech.