LG Faces Class Action Lawsuit Over G4 And V10 Repeated Bootloop Problems

LG is catching more heat over reported bootloop issues affecting two of its previously top-end handsets, the G4 and V10. With the matter still unresolved for many owners of both smartphones, the South Korean electronics firm now faces a class-action lawsuit that was filed in California. The suit seeks damages in an amount to be determined at trial, and also asks that a judge order LG to implement a program to repair all affected phones.


Complaints about the so-called bootloop issue in regards to the G4 abound all over the Internet, everywhere from social media sites and Reddit, to YouTube and little nooks and crannies around the web. Fed up users also posted a petition demanding that LG launch a replacement program for defective G4 devices. Complaints about the V10 are rather easy to find, as well.

LG actually admitted to a problem with its G4 handsets a little over a year ago, saying that a "loose contact between components" was causing issues. The class-action lawsuit points out that even though LG knew there was an issue, the company never issued a recall or offer any sort of satisfactory remedy to affected owners. LG also refused to fix devices that entered into an endless boot cycle if the warranty had expired.

As for the V10, its hardware is similar to that of the G4. It only took a few months after release for reports of bootloop issues to surface on that model as well. The class-action lawsuit takes issue with the fact that LG continued to sell the device even after being made aware that there was an apparent problem.

One of the plaintiffs listed in the lawsuit said he replaced his LG G4 phone two times due to the bootloop issue, and that his third G4 often freezes, forcing him to remove the battery. His wife's G4 also fell into an endless boot cycle, but since it was a few months out of warranty, LG would not replace it.

According to the lawsuit, both phones suffer from improper soldering of the processor to the motherboards. As a result, the solder bumps connecting the SoC to the motherboard are prone to cracking and failing from the heat generated by normal use.