Qualcomm Shoots Down Overheating Reports, Says Galaxy S6 Will Receive Revised Snapdragon 810
It came out last week that Samsung ran into an overheating issue when testing Qualcomm's Snapdragon 810 chip in its forthcoming flagship phone. In turn, Samsung reportedly made the decision not to use the part in its unreleased Galaxy S6 device, though that might not be the case if Qualcomm can supply a revised version in time for the handset's release.
According to The Wall Street Journal and a "person familiar with the matter" that it spoke with, Qualcomm is expected to supply Samsung with a revised version of the Snapdragon 810 in March. Presumably the next revision will have a better handle on thermals, enough so that Samsung will feel comfortable using it in place of its own Exynos hardware.
Interestingly enough, LG confirmed plans to use the Snapdragon 810 part in its upcoming G Flex 2 handset that's due to launch in South Korea at the end of the month, and sometime after in the U.S. LG's vice president of mobile product plannings Woo Ram-chan said he was "very much aware of various concerns" over the reported overheating issue, but that it hasn't been a problem for LG.
"Heat levels don't depend entirely on the CPU, but also on how the phone's internal cooling system is designed," said Choi Young-su, a vice president for LG's smartphone development.
Heat isn't the only issue facing Qualcomm. With the Galaxy S6 due to release in the not-too-distant future, Qualcomm finds itself in a bit of a time crunch. If the company can't get revised chips into Samsung's hands within the next couple of months, Samsung will forge ahead with its own Exynos hardware.
According to The Wall Street Journal and a "person familiar with the matter" that it spoke with, Qualcomm is expected to supply Samsung with a revised version of the Snapdragon 810 in March. Presumably the next revision will have a better handle on thermals, enough so that Samsung will feel comfortable using it in place of its own Exynos hardware.
Interestingly enough, LG confirmed plans to use the Snapdragon 810 part in its upcoming G Flex 2 handset that's due to launch in South Korea at the end of the month, and sometime after in the U.S. LG's vice president of mobile product plannings Woo Ram-chan said he was "very much aware of various concerns" over the reported overheating issue, but that it hasn't been a problem for LG.
"Heat levels don't depend entirely on the CPU, but also on how the phone's internal cooling system is designed," said Choi Young-su, a vice president for LG's smartphone development.
Heat isn't the only issue facing Qualcomm. With the Galaxy S6 due to release in the not-too-distant future, Qualcomm finds itself in a bit of a time crunch. If the company can't get revised chips into Samsung's hands within the next couple of months, Samsung will forge ahead with its own Exynos hardware.
