VIA Launches First Single-Chip Embedded Chipset, the VIA CX700, at ESC 2006
Ground-breaking high performance all-in-one x86 chipset for ultra compact embedded systems underscores VIA's leadership in x86 miniaturization and integration, garners broad industry support
Fremont, California, 4th April 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA CX700 digital media IGP chipset for the VIA C7(R) and Eden(R) processor platforms, the most advanced x86 embedded chipset that integrates all the cutting-edge features of a modern chipset's North and South bridges, including rich video graphics, HD audio, and DDR2 and SATA II support, into a single, compact and highly power-efficient package.
Designed specifically for the embedded market and already adopted by leading industry players, the VIA CX700 will be on display at the VIA booth #1145 and partners' booths at the Embedded Systems Conference show in San Jose, California this week.
"A true single-chip integration that delivers the performance, flexibility and power efficiency demanded by embedded developers, the CX700 looks set to drive x86 further into the embedded space and enhance VIA's momentum in this market," said Chinhwaun Wu, Special Assistant to the President, Processor Platform Product Marketing, VIA Technologies, Inc. "Fully embodying VIA's design strategy of shrinking the platform while supporting contemporary video, audio, memory and peripheral technologies, the CX700 represents the next phase of innovation in enabling more compact and sophisticated x86 systems."
Rich Feature Integration: A host of leading digital media, memory and connectivity technologies are packed into the single-chip package of the VIA CX700:V
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