NXP Looks to Revolutionize Mobile Audio Performance with TFA9887 IC Audio System

NXP Looks to Revolutionize Mobile Audio Performance with TFA9887 IC Audio System

In the press release announcing NXP’s new audio system that portends to jack up the output power of tiny mobile device speakers by a factor of 5, NXP director of marketing Shawn Scarlett hit the nail on the head with this quote: “Digital natives have come of age taking poor mobile sound quality for granted. As speakers have become smaller, the quiet, tinny sound we’ve come to associate with mobile devices has got even worse.”

NXP is out to change all that with the NXP TFA9887 IC audio system, which includes an embedded algorithm that can drive over 2.6W RMS through speakers that, up to this point, were only capable of 0.5W without causing damage to the speakers. The system uses adaptive excursion control, real-time temperature protection, and current-sensing amplification to intelligently maximize the audio performance while sensing and adjusting to aspects such as enclosure damage and battery voltage.

NXP audio system chip

The NXP TFA9887 IC system is on a single chip and features NXP’s own CoolFlux audio DSP amp and DC-to-DC boost converter.

NXP excursion limit

NXP calls the new micro driver “revolutionary”, and we surely hope it is. Any improvement to mobile device speaker performance is most welcome.
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By looking at the graphic, isn't this simply a hardware-based compressor, expander, limiter? Nothing revolutionary here. Current generation mobile processors have the ability to do this processing in software with no sweat. Further, I'm sure that this generation of mobile processors or the next will allow these simple audio processing tasks to be passed on to the graphics processing core in a GPGPU way thus mooting the need for an extra NXP audio processor. Had they introduced this several years ago, it would've been "revolutionary". Now, it is simply marketing hype.

Hmm.... Perhaps if this is more than simply an audio shaper IC and there are other hardware components supplied and required by the package to handle the realtime monitoring aspects that are mentioned, then I can see this being of value. If indeed that is the case, they would do better to license the technology to manufacturers such they can implement it more efficiently themselves. In this age of smaller/thinner, the last thing designers want is to squeeze another chip onboard.

Ok... from information on their page about the product...

http://www.nxp.com/news/press-releases/2012/07/revolutionary-mobile-audio-solution-delivers-over-5-times-the-power-to-micro-speakers.html

"...the TFA9887 monitors speakers through a current-sensing amplifier and enables safe operation while working at near peak output at all times."

...it is the on-chip current-sensing amplifier that is the unique component. Mobile CPU/GPUs will not have this. Still, I think it would be better for them to license the technology to mobile CPU manufactures so that they can more efficiently implement this solution. This technique could also benefit PC audio.

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