Claiming up to twice the performance of current standard CPU coolers, IBM has given us a glimpse of their latest cooling technology. The technology concerns the layer of thermally conductive paste between the chip and the heatsink. Taking inspiration from nature, IBM has developed a unique surface design with a series of branched channels on its surface, in order to equally disperse the thermal paste when pressure is applied. As well as this approach, IBM is also developing another new technique called "direct jet impingement", which is a new type of water cooling system.
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