We continue to bring you breaking coverage from IDF today with a look inside keynote talks from Gordon Moore and Pat Gelsinger.
Snip: “Pat next focused on Intel’s current and future I/O innovations. He talked about the Tulapi SOC (System on a Chip) accelerator and then spoke of USB 3.0. According to Pat, USB 3.0 will offer a 10X increase in performance over USB 2.0 and will use both copper and optical interconnects. He also held up a couple of pro-type USB 3.0 cables to show the room what they looked like.”
Editor In Chiefhttp://hothardware.com
Skulltraill is on the Seaburg chipset, not X38
Duly noted. I should have had a comma in there after X38. My bad. Typo, fore-shame! :)
NEWS TIPS |
This site is intended for informational and entertainment purposes only. The contents are the views and opinion of the author and/or hisassociates. All products and trademarks are the property of their respective owners. All content and graphical elements areCopyright © 1999 - 2014 David Altavilla and HotHardware.com, LLC. All rights reserved. Privacy and Terms