IDF Day 1: Keynotes, Skulltrail, PCIe3.0, 32nm - HotHardware
IDF Day 1: Keynotes, Skulltrail, PCIe3.0, 32nm

IDF Day 1: Keynotes, Skulltrail, PCIe3.0, 32nm

We continue to bring you breaking coverage from IDF today with a look inside keynote talks from Gordon Moore and Pat Gelsinger.


Snip:  “Pat next focused on Intel’s current and future I/O innovations.  He talked about the Tulapi SOC (System on a Chip) accelerator and then spoke of USB 3.0.  According to Pat, USB 3.0 will offer a 10X increase in performance over USB 2.0 and will use both copper and optical interconnects.  He also held up a couple of prototype USB 3.0 cables to show the room what they looked like.”

 

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