It was only a year ago that Globalfoundries
announced plans for a major global capacity expansion. And now? Globalfoundries today said it's ready to start moving 300mm semiconductor wafer fabrication equipment into its newly constructed cleanrooms in New York and Dresden. The technical term for this milestone is called "Ready for Equipment," which is just what it sounds like and signifies that these two plants are ready to move from the construction phase to the operations phase.
"At Globalfoundries, we continue to invest aggressively in driving sustained growth on advanced technologies," said Globalfoundries CEO Ajit Manocha. "The build-out of our 300mm manufacturing campuses in New York and Dresden is supporting growing customer demand for advanced technologies, while creating hundreds of jobs and providing a significant boost to the economies in the surrounding regions. By completing these massive construction projects on schedule and on budget, we are continuing to deliver on our commitment to being the only truly global foundry."
The expansion project at Fab 1 in Dresden, Germany, will add more than 110,000 square feet of cleanroom space to the site and allow it to operate as one integrated cleanroom, making it the largest wafer fab in Europe.
Meanwhile, Globalfoundries says its Fab 8 will stand as the most technologically advanced wafer fab in the world and the largest leading-edge semiconductor foundry in the U.S. once fully built-out and ramped. The total facility will span 1.9 million square feet and is expected to come online in 2012 with a focus on 28nm manufacturing.