DisplayLink will be showing off its new SuperSpeed USB (USB 3.0) chip platform for next generation displays, docking stations and other integrated devices at the Intel Developer Forum next week. The new DL-3000 and DL-1000 series DisplayLink single-chip family features integrated display and networking connectivity and high performance audio and HD video support. It also has third generation DisplayLink adaptive real-time compression technology that dynamically manages bandwidth and takes advantage of bi-directional throughput of SuperSpeed USB. This enables multiple full HD videos, high resolution graphics, and networking data to be processed simultaneously. Products with the new DisplayLink DL-3000 and DL-1000 technology are expected to reach the market in the first half of 2011.
DisplayLink SuperSpeed USB 3.0 Chip Platform Takes Major Step Toward
Any Device, Any Display Connectivity
Interactive Channel of Graphics, Video and Audio to Drive Development of
a New Class of Entertainment and Business PC Devices
Intel Developer Forum San Francisco 2010
PALO ALTO, Calif.--(BUSINESS WIRE)--DisplayLink Corp., the market share leader with more than three million USB graphics users worldwide, today provided a glimpse at its new SuperSpeed USB (USB 3.0) chip platform for next generation displays, docking stations and other integrated devices to be showcased next week at the Intel Developer Forum in San Francisco, California, in booth #948.
The new DisplayLink single-chip family, DL-3000 and DL-1000 series, includes integrated display and networking connectivity, high performance audio and HD video support, as well as third generation DisplayLink adaptive real-time compression technology that dynamically manages bandwidth, taking full advantage bi-directional throughput of SuperSpeed USB. This means multiple full HD videos, high resolution graphics and networking data can be processed simultaneously, while also substantially increasing today's HighSpeed USB (USB 2.0) graphics performance and enabling graphics delivery over gigabit Ethernet.
This new platform will enable a wide range of applications that create an interactive connection between device and display. These include:
“DisplayLink technology has enabled the new category of universal docking stations, in addition to zero clients and other devices that are used by major corporations and educational institutions globally,” added Dennis Crespo, executive vice president of marketing and business development at DisplayLink. “We look forward to working with our customers to develop a host of next-generation, creative devices that solve real world problems for the digital consumer.”
SuperSpeed USB is capable of running up to 10 times faster than the previous generation of the technology transferring data at speeds of up to 5Gbps.
“DisplayLink is stepping to the forefront of SuperSpeed USB technology, enabling OEMs to offer state-of-the-art products that are capable of transmitting a vast amount of data very quickly,” said Jeff Ravencraft, president and chairman, USB-IF. “SuperSpeed USB enables new compelling use cases, such as blazing fast graphics, HD video and 3D gaming over the same USB bus.”
Features of the new DisplayLink chip platform for SuperSpeed USB include:
“The prevalence of USB ports and the increased power of USB 3.0 make it well-suited as a display and docking station connector for both consumer and business markets, especially in today’s mobile environment. Ideally, standard network interfaces should be easy to incorporate into devices and able to handle multiple interactive tasks such as audio, graphics and video across a variety of displays,” said Rhoda Alexander Director of Monitor Research for iSuppli.
Products with integrated DisplayLink DL-3000 and DL-1000 technology are expected to reach the market in the first half of 2011.
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