XX-Sep-2008 XX:XX PM xxxxxx :
Request to qualify Nvidia G92 GPU bump material change for M86 for known Nvidia bump crack issue in order to support MPS and enhance package robustness.
06-Sep-2008 03:27 PM xxxxx :
NVIDIA will transition from using high-lead solder (95%Pb/5%Sn) to eutectic solder (63%Sn/37%Pb) flip-chip bump material for the G92 product family. During the transition period NVIDIA will be supplying both high-lead and eutectic bump until inventory is depleted. No other materials are being changed.M86 refers to a desktop. Ouch.
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