VIA Unveils 1.2GHz VIA Nano X2 Dual-Core CPU And VX900H Media Processor
Measuring 95mm x 125mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.
Along with the VIA COMe-8X90 module, VIA offers a starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions. Pricing remains under wraps, but we should hear more as it's unveiling at the Embedded World 2012 Exhibition and Conference.