VIA's Mobile-ITX Platform Is 50% Smaller Than Pico-ITX - HotHardware
VIA's Mobile-ITX Platform Is 50% Smaller Than Pico-ITX

VIA's Mobile-ITX Platform Is 50% Smaller Than Pico-ITX

When Pico-ITX hit the market in mid-2008, many figured that it would be quite some time before we saw a replacement shrink any further. Leave it to the folks at VIA to prove us all wrong. Today, the company is introducing its newest platform, one that's a whopping 50% small than Pico-ITX, which itself is quite a bit smaller than Micro-ITX.

The new platform is called Mobile-ITX, and at 6cm x 6cm, it promises to enable all sorts of next-generation devices. Applications for this mostly live in the medical and military market, but with converged devices shrinking all the time, we suspect it's only a matter of time before this finds use in the commercial world.

Mobile-ITX employs a modularized design that includes a CPU module card and an I/O carrier board, and CPU modules based on the Mobile-ITX form factor integrate core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customizable baseboards. As for power consumption? As little as 5-watts, meaning that these are perfect for always-on scenarios.



VIA Mobile-ITX Brings Further Miniaturization and Greater Flexibility to Embedded Devices

Incredibly compact, 6cm x 6cm Mobile-ITX form factor is 50% smaller than Pico-ITX, enables next-generation embedded devices

Taipei, Taiwan 1 December 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines a uniquely compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems.

Vertical market segments including medical, transportation and military embedded markets have evolved to demand greater miniaturization and portability from today’s x86 platforms. Mobile-ITX addresses the need for a simple, modular approach to portable IPC design, making it easier than ever to bring to market ultra-compact and lightweight devices that offer comprehensive connectivity options and a rich, flexible feature set.

“With Mobile-ITX we have again pushed back the barriers that limit just how small an embedded industrial PC can be,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “Mobile-ITX enables the creation of a new breed of ultra-compact, portable networked devices suitable for a range of applications, particularly in modern medical and military segments.”

Mobile-ITX – The Science of Small

Extending VIA’s reputation as a leading innovator and creator of ultra-compact form factors, Mobile-ITX at 6cm x 6cm, is currently the most compact computer-on-module form factor on the market, an incredible 50% smaller than the successful VIA-developed Pico-ITX form factor.

Mobile-ITX employs a modularized design that includes a CPU module card and an I/O carrier board. This offers greater flexibility for developers who can simply drop in the CPU module to a custom designed, application specific carrier board, negating lengthy developmental design and testing phases.

CPU modules based on the Mobile-ITX form factor integrate core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customizable baseboards. In keeping with VIA’s signature low power philosophy, Mobile-ITX-based modules consume as little as 5 watts, ideal for always-on, mission critical systems.

This comprehensive range of advanced technologies can be implemented on a variety of Mobile-ITX compatible carrier board designs that can be adapted to suit almost any environment, or application specific criteria. The CPU module I/O signals are mapped to two unique high density, low profile connectors on the under side of the module, with a distance between the CPU module and the baseboard of only 3mm, making it ideal for ultra-slim system designs. The connectors can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.

More details about the Mobile-ITX form factor may be found at the VIA website where you can also find a detailed “Mobile-ITX Form Factor” white paper:

www.via.com.tw/en/initiatives/spearhead/mobile-itx/

For images related to the Mobile-ITX form factor, please visit:

http://www.viagallery.com/index.php?option=com_flickr4j&Task=sets&Set=72157622786386107&Page=1

The VIA Embedded Platform Division will announce the first commercial CPU module based on the Mobile-ITX form factor in Q1 2010.

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw


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Looks about the right size for an x86-based handheld device... but I have to believe that ARM processors would eat it's lunch when it came to performance and power consumption.

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I want something that small to run WinXP on as a XIM360 server. Think I could cram it on there?

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Mmm. Looks delicious for a storage server!!

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Storage handling is what I would want it for.

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