VIA Delivers First Single-Chipset Solution for UMPCs
Continuing VIA's philosophy of "Small is Beautiful", the VIA VX700 chipset ideally complements the VIA C7-M processor to inspire a new generation of PC-phones combining communication, multimedia, and computing
Taipei, Taiwan, July 6 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA VX700 chipset to build on the success of the VIA Ultra Mobile platform in UMPC devices, enabling reduction of mobile form factors by up to 40%.
UMPCs (Ultra Mobile PCs) is an exciting new category of devices that can fit comfortably into a pocket or handbag enabling users to access and interact with their entire digital world wherever they go. Creating exciting opportunities for entertainment, productivity, and communication focused products the VIA VX700 is the next step in this mobile future, enabling smaller form factor "computing" devices with reduced power consumption and enhanced functionality. As the first single chip implementation of its kind for ultra mobile devices, the VIA VX700 continues VIA's history of chipset innovation and blazes a strong path for a new breed of digital companions. READ MORE...
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