Samsung Develops New 32GB RDIMM - HotHardware
Samsung Develops New 32GB RDIMM

Samsung Develops New 32GB RDIMM

Samsung Electronics has announced the creation of a new 32GB RDIMM with 3D TSV technology.

The RDIMM (registered dual inline memory module) was made by stacking DDR3 SDRAMs that were manufactured by using 30nm-class process technology, and those SDRAMs were connected using the TSV (through silicon via) technology.

This new module can provide speeds of up to 1,333Mbps and has a power consumption of 4.5 watts per hour, which is more than 30% smaller than the power consumption of an LRDIMM (load-reduced dual-inline memory module) using DDR3 SDRAMs made with the same technology as above. The modules are targeted for high-end applications such as server operation.


Samsung had previously announced the creation of another 32GB RDIMM with the same technology that can reach speeds of up to 1,866Mbps, but the company did not comment on the link between the previous module and the new one. Samples of the new modules are currently being shipped for evaluation by users.
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"Damn, 32GB on one stick, I dont think a can even come close to even using half right now. But still drool worthy"

-Optimus

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I agree very drool worthy!!! I was excited to upgrade from 3gb to 16gb!!!! I can't imagine 32.....would make my renders fly!

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Totally drool worthy. Are there non enterprise mobo's that support such massive amounts of ram per channel?

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This is totally sweet technology. Truly meant for high use servers such as data center machines.

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