Ever heard of a "memory wall?" You have now, and evidently Micron and Samsung are working together to break it all down. Both companies are obviously big players in the memory space, and the two have launched the Hybrid Memory Cube Consortium, with the goal of accelerating Hybrid Memory Cube technology development and adoption. Hybrid Memory Cube is a revolutionary innovation in DRAM memory architecture that breaks through the memory wall, setting a new standard for performance, power efficiency, reliability and cost. The Consortium will bring together OEMs, enablers and integrators committed to delivering the promise of HMC to a range of applications, including networking, storage and high-performance computing.
Micron and Samsung are the founding members of the Hybrid Memory Cube Consortium (HMCC), and will work closely with fellow developers Altera Corporation, Open Silicon, Inc., and Xilinx, Inc. to collectively accelerate industry efforts in bringing to market a broad set of technologies. The consortium will initially define a specification to enable applications ranging from large-scale networking to industrial products and high-performance computing. One of the primary challenges facing the industry — and a key motivation for forming the HMCC — is that the memory bandwidth required by high-performance computers and next-generation networking equipment has increased beyond what conventional memory architectures can provide. The term “memory wall” has been used to describe the problem. Breaking through the memory wall requires a new architecture that can provide increased density and bandwidth at significantly reduced power consumption.
HMC could lead to unprecedented levels of memory performance and facilitate new applications in networking, medical, energy, wireless communications, transportation, security and other markets. For example, the development of systems and technologies will enable a more efficient, reliable and secure smart grid infrastructure with integrated renewable energy resources. The HMCC’s memory specifications will be co-developed among the consortium members. The consortium is open to an unlimited number of adopters, with the opportunity to receive early access to draft specifications and participate in specification discussions and development. Additional information, technical specifications, tools and support for adopting the technology can be found at www.hybridmemorycube.org.
Faster SSDs. Smarter memories. Six-core CPUs. We're living in a magical place.