IBM has announced a new breakthrough in chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips...
The release states that IBM is already running chips using the new through-silicon via technology in house and that the company will begin making sample chips using the tech available to customers in the second half of this year, with production in 2008. The first application of through-silicon via technology will be in wireless communications chips that will go into power amplifiers for wireless LAN and cellular devices.
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