VIA Announces Comprehensive Support for TPM Technology

VIA works with industry partners to enable a new generation of PCs equipped for safer computing

Taipei, Taiwan, 30 March 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced cooperation with industry partners to ensure broad TPM support for VIA's market-leading lineup of chipset solutions for the Intel^(R), AMD, and VIA processor platforms.

Trusted Platform Module (TPM) technology is an industry effort aimed at reducing some of the risks facing modern day computing. Addressing issues such as data theft, unauthorized PC access, and unauthorized network access, the TPM standard incorporates a number of capabilities that will be increasingly important as businesses and users give greater priority to safe computing. The TPM architecture comprises a discrete module connected through the chipset South Bridge, with associated BIOS support. As a premium chipset provider, VIA has been working with industry partners to ensure leading TPM support to meet growing customer requirements.

Working with leading industry partners, VIA has validated STMicroelectronics TPM modules together with VIA's latest South Bridge solutions, and leading BIOS solutions from AMI and Insyde Software supporting TPM technology.

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