Intel Boosts Energy Efficient Performance With First Dual-Core Low-Voltage Intel Xeon Processor
HILLSBORO, Ore., March 14, 2006 – Intel Corporation is outfitting server, storage and telecommunications equipment makers with a new ingredient for squeezing more performance out of space– and power–constrained environments. It is the first low–voltage Intel(R) Xeon(R) processor to combine dual–core technology with Intel's innovative power management capabilities, helping to boost energy–efficient price/performance with up to two to four times the performance–per–watt of previous Intel Xeon processors and platforms.**
The historical need for raw computing performance has evolved into a drive for energy–efficient performance to meet people's expanding demands – whether for smaller devices, lower cooling bills or better price/performance per watt. Energy–efficient performance enables equipment manufacturers to optimally balance processing capabilities with power and space constraints to help meet those demands. Intel is driving innovations in multi–core computing architectures through a combination of silicon, architecture, platform and software innovations to enable new levels of performance, capabilities and energy efficiency.
With total dissipated power (TDP) of 31 watts, the new low–voltage Dual–Core Intel Xeon processor is ideal for deployments requiring high compute density and power optimization, including single–height (1U) chassis and blade servers, SAN and NAS solutions, and network infrastructure equipment. The new processor excels at handling demanding multi–threaded, multi–tasking applications such as high–performance computing and financial services.
"The low–voltage Dual–Core Intel Xeon processor's combined enhancements in performance and energy efficiency, along with the efficient power and cooling design of IBM's industry–leading BladeCenter*, deliver a leadership integer performance–per–watt solution," said Doug Balog, vice president and business line executive, IBM BladeCenter. "The new IBM BladeCenter Ultra Low Power HS20 blade* is a solid example of the innovation being brought to market through Intel and IBM's blade collaboration."
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